Photonic microsystems "from Fab to Lab"
The Fraunhofer Institute for Photonic Microsystems IPMS in Dresden is a leading international research and development service provider for electronic and photonic microsystems in the application fields of intelligent industrial solutions, medical technology, healthcare and mobility.
The cleanrooms at Fraunhofer IPMS are equipped to industry standards:
- 1,500 m² MEMS and MOEMS cleanroom - TRL 3 - 8 - from process development to pilot production (200 mm)
- 300 m² microdisplay cleanroom (200 mm)
- 2,700 m² CMOS cleanroom at 300 mm - BEoL & FEoL
Extensive analytical and characterization tools complete the offer.
Through its research in key technologies, Fraunhofer IPMS promotes the development of independent and sustainable solutions that meet the needs of the global market. The institute works closely with industry to drive innovation and ensure competitiveness.
Fraunhofer Institute for Photonic Microsystems IPMS, Dresden
IC design skills
The design of application-specific integrated circuits enables the production of highly complex microelectronic components such as microdisplays and optoelectronic sensors. The methodology of this design process is based on circuit simulation, layout design and verification. Fraunhofer IPMS in Dresden creates these designs using industry-standard software tools and implements them in mixed analog / digital CMOS processes in collaboration with silicon foundries worldwide. Once the circuits have been manufactured in silicon, the functionality is verified by tests at wafer and component level, after which prototypes are created. The transfer to pilot production can then take place on a project-specific basis.
Fraunhofer IPMS occupies a unique position in the design of microelectronic circuits and components, as it makes application-specific and customer-specific adaptations to the CMOS processes of silicon circuit factories, which make it possible to subsequently apply OLED layers to the finished wafers, for example. This post-processing is used in particular to extend the functionality of silicon CMOS wafers with optical and photonic components, for example for high-resolution OLED microdisplays.
- Design of microelectronic circuits and modules through application-specific adaptation of CMOS processes
- Industry-compatible circuit simulation, layout design and verification
- Implementation in mixed analog/digital CMOS processes of silicon circuit factories
- Prototype production, transition to pilot production