IC design for future-oriented applications

The entire IC design process, from circuit design to physical implementation, is mapped at the Saxony site, including antenna design for analogue chips and standardized housing design for chip encapsulation.

GDS image of a test chip design by Racyis Dresden
Racyics GmbH, Dresden

The chips - prototypes and serial production - are manufactured in cooperation with semiconductor foundries based in Saxony, such as Globalfoundries or X-FAB.

Customer-specific carrier boards are developed for digital chips and the final tests are carried out in specialized laboratories. The chips are intended for safety-critical applications in areas such as communication, sensor technology and industrial automation.

Saxony`s players have particular expertise in the development of innovative design concepts to meet the challenges of miniaturization and increasing complexity in electronics. In particular, new technologies are being investigated in order to combine different assemblies into individual components and thus improve performance and energy efficiency.

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